Call for Nominations: Editor-in-Chief IEEE Transactions on Device and Materials Reliability

The IEEE Transactions on Device and Materials Reliability (TDMR) provides leading edge/state of the art information that is critically relevant to the creation of reliable microelectronic products.The Transactions is a forum for interdisciplinary studies on reliability and publishes original and significant research contributions on reliability of Electronic and Photonic Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Process Technology (CMOS, BiCMOS, etc.) and Integrated Circuits (IC, SSI, MSI, LSI, ULSI, etc.) and Packages.The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database of the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market.Reliability, in a sense, is everything that can be or has to be done to guarantee that the product successfully performs in the field under customer conditions.Our goal is to capture these advances.