A Novel Temperature Drift Error Estimation Model for Capacitive MEMS Gyros Using Thermal Stress Deformation Analysis

Because the conventional Temperature Drift Error (TDE) estimation model for Capacitive MEMS Gyros (CMGs) has inadequate Temperature Correlated Quantities (TCQs) and inaccurate parameter identification to improve their bias stability, its novel model based on thermal stress deformation analysis is presented. Firstly, the TDE of the CMG is traced precisely by analyzing its structural deformation under thermal stress, and more key decisive TCQs are explored, including ambient temperature variation ∆