A Solvent-free Processed Low-temperature Tolerant Adhesive

Abstract Ultra-low temperature resistant adhesive is highly desired yet scarce for material adhesion for the potential usage in Arctic/Antarctic or outer space exploration. Here we develop a solvent-free processed low-temperature tolerant adhesive with excellent adhesion strength and organic solvent stability, wide tolerable temperature range (i.e. -196 to 55°C), long-lasting adhesion effect (> 60 days, -196°C) that exceeds the classic commercial hot melt adhesives. Notably, manufacturing at scale can be easily achieved by the facile scale-up solvent-free processing, showing much potential towards practical application in Arctic/Antarctic or planetary exploration. One Sentence Summary: We have designed a kind of solvent-free adhesive with excellent low temperature resistance up to -196°C and can be readily scale-up manufactured on a kilogram scale through a solvent-free heat-assisted process.