Mm-wave wireless communication and sensing heavily rely on phased arrays to compensate for high path losses and meet link-budget targets. Recent mm-wave arrays have grown increasingly complex, often with many parallel RF paths integrated on a single front-end/beamformer chip [1]. Dual-polarization and multiband operation further multiply the number of RF front-end paths. Consequently, one technology trend of array front-end chips is to aggressively miniaturize RF building blocks for integration and cost saving, while simultaneously achieving higher energy efficiency to maintain the thermal density and ease the packaging.
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Liu et al. (2024) studied this question.
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