Study on sonic-assisted processing method for micro pattern formation on Cu film

In semiconductor processing to form surface shapes, photolithography and dry etching are used. In this case, the vacuum process requires improvements cost and productivity. We propose a sonic-assisted processing method using the resonance phenomenon of stainless used steel plate diaphragms. This method is characterized by vibrating the diaphragm with sound pressure to vibrate the particles and microfabricate on Cu thin film [1][2]. To evaluate the sonic-assisted processing method, we attempted to process Cu wafers by transmitting vibrations perpendicular to the wafer to a SUS plate diaphragm as a micro-shape transfer process using a micro-pattern pad. As a result, 100 µm length and 20 µm width grooves were formed on the Cu wafer surface.