Microbial-Induced Corrosion on Copper Coupons and Resistance of Corrosion by Copper Nanoparticles

The research project discusses the anti-corrosion behaviour of copper chloride nanoparticles synthesized. The corrosion behaviour mechanism of the copper coupon was investigated using bacterial and fungal isolates. Surface or topological analysis was performed using SEM and AFM analytical methods. The weight loss results revealed that a higher corrosion rate was observed in bacterial-treated (0.40 ± 0.1 mm/y) compared with that of fungal-treated (0.26 ± 0.01 mm/y) at the end of the exposure period of 336 h. Microbial colonies accelerate corrosion by creating localized corrosive environments. The corrosion rate of copper exposed to bacteria was found to be 0.033 mm/year, and that of fungi was found to be 0.016 mm/year. Scanning electron microscopic images of both nanoparticles-coated copper coupons and the epoxy nanoparticle-coated workpiece exhibited no pitting and a smooth surface, thereby showing anti-corrosive properties.