Electroless Plating Process Optimization for Successful Copper Coatings Deposition on Surgical Tools

Copper coatings are valued for their protective, decorative, and antibacterial properties, driving their market growth. Traditional electroless copper baths use cupric sulphate (CuSO4) and carcinogenic formaldehyde (HCOOH), which harms the environment and humans. This study proposes sodium hypophosphite (NaH2PO4·H2O) as an eco-friendly reducer for nickel-substrate copper deposition. Three plating process variables were optimized for successful copper plating: sodium hypophosphite concentration (0.55 M-0.75 M), bath pH (9.5-12.5) and temperature (65-90°C). Next, the deposited coatings underwent the microstructural and chemical analyses using scanning electron microscopy and X-ray diffractometry followed by roughness determination by atomic force microscopy. Based on them, the optimum conditions for effective electroless copper plating were identified, ensuring an environmentally safer alternative for classic formaldehyde-based electroless baths.