Semiconductor wafer manufacturing is one of the most complex and data-intensive industrial processes, comprising 500–1000 tightly interdependent steps, each requiring nanometer-level precision. As device nodes approach 3 nm and beyond, even minor deviations in parameters such as oxide thickness or critical dimensions can lead to catastrophic yield loss, challenging traditional physics-based control methods. In response, the industry has increasingly adopted regression analysis and predictive modeling as essential analytical frameworks. Classical regression, long used to support design of experiments (DOE), process optimization, and yield analysis, has evolved to enable multivariate modeling, virtual metrology, and fault detection. Predictive modeling extends these capabilities through machine learning and AI, leveraging massive sensor and metrology data streams for real-time process monitoring, yield forecasting, and predictive maintenance. These data-driven tools are now tightly integrated into advanced process control (APC), digital twins, and automated decision-making systems, transforming fabs into agile, intelligent manufacturing environments. This review synthesizes foundational and emerging methods, industry applications, and case studies, emphasizing their role in advancing Industry 4.0 initiatives. Future directions include hybrid physics–ML models, explainable AI, and autonomous manufacturing. Together, regression and predictive modeling provide semiconductor fabs with a robust ecosystem for optimizing performance, minimizing costs, and accelerating innovation in an increasingly competitive, high-stakes industry.
Chen et al. (2025) studied this question.