Simulation and experimental study on the heat dissipation performance of the air-cooled heat sink

This paper introduces a method for thermal simulation of air-cooled modules using FloTHERM. The orthogonal optimization method was employed to fine-tune the fin parameters by analyzing the simulation results. This optimization effectively reduced the DSP chips' maximum junction temperature and improved the temperature field's uniformity. Additionally, a thermal simulation platform for air-cooled modules was developed, and the experimental results confirmed the reliability of the simulation outcomes. Furthermore, the paper experimentally evaluated the heat dissipation performance of various heat sinks, offering valuable references for selecting air-cooled heat sinks under different environmental conditions.