Study on the electrothermal properties of bisilane synergistically modified SiO2/epoxy resin composites

Epoxy resin-based composites are widely used in high-voltage electrical equipment due to their excellent electrical insulation properties, yet their inherent performance still exhibits scope for improvement. To enhance both the electrical breakdown strength and thermal stability of epoxy composites, this study proposes and conducts simulation analysis on the performance of epoxy composites reinforced by silica nanoparticles co-modified with KH550 (aminosilane) and KH560 (epoxy silane). Departing from conventional unary silane coupling agent modification methods, this research employs binary silane co-modification exploiting the reactive amino groups of KH550 and epoxy functional groups of KH560 for synergistic surface treatment. This approach aims to fully leverage the complementary advantages of these two silanes, substantially optimizing both interfacial compatibility and chemical bonding strength between fillers and the matrix.