Conformable organic thin-film transistors (OTFTs) are identified as a core electronic component for next-generation wearable and implantable electronics. However, the lack of high-level integration of high-performance conformable devices remains a major obstacle to the commercialization of organic transistors. Here, a universal and non-destructive dual protective layer photolithography strategy is proposed, which is compatible with all organic materials, including conductors, semiconductors and insulators, with pattern precision of 0.5 µm. This approach enables the fabrication of ultrahigh-density OTFTs that demonstrate a mobility of 2.21 cm2V-1s-1 at a density of 64,288 transistors/cm2, scalable to scaled up to 5,120,000 transistors/cm2 while maintaining a mobility of ~1 cm2V-1s-1. Moreover, the devices show remarkable stability (10,000 switching cycles/100,000 folding cycles) and have been successfully integrated into sub-micron circuits and flexible displays, demonstrating strong application potential. This work offers a universal wafer-level manufacturing and integration pathway for ultrahigh-density, high-performance conformable devices, advancing the industrialization of conformable electronics. Fabrication and integration of conformal devices on a large scale remains a challenge for commercialization. Here, the author developed a non-destructive photolithography method suitable for all organic materials, achieving 0.5 μm resolution and a device density of 5,120,000 transistors cm-2.
Ni et al. (Mon,) studied this question.