Study on Microstructure Evolution and Influencing Factors of Pure Copper Wire After Directional Heat Treatment

The Ohon Continuous Casting is the main method for preparing single crystal copper wire, and it is also the research hotspot at present, but it is difficult to directly cast ultrafine single crystal copper wire (diameter < 0.05 mm). The copper wire obtained by continuous casting must be drawn and deformed before it can be used in practice, but this will bring a series of problems such as single crystal structure destruction and conductivity deterioration. Directional heat treatment technology can control the direction of heat flow at a low temperature, realize the directional migration of grain boundaries in the recrystallization process, and form columnar crystals or single crystals, which is of great significance for improving electrical conductivity. In this paper, the directional heat treatment method was used to investigate the microstructure evolution and influencing factors of pure copper wire, the process parameters were optimized, and the conductivity of pure copper wire was measured. It was found that the conductivity of pure copper wire increased by 5% when the heating temperature was 750 °C and the withdrawing velocity was 15 μm/s, which laid a foundation for the improvement of conductivity of pure copper wire.