Multiphysics Nanoparticle Assembly: Design, Simulation, and Applications

For over a decade significant progress has been made in the synthesis and characterization of novel nanomaterials. Many of these unique low dimensional materials have promising electrical, optical, quantum, magnetic, and mechanical properties. However, there have been limited improvements in processes and equipment required to integrate these materials into next-generation microelectronics. Dielectrophoresis (DEP) is a leading method for the parallel integration of nanoparticles onto patterned electrodes. However, its application in manufacturing is severely hindered by the rapid decay of the DEP force with distance from the substrate. While microfluidic channels can force nanoparticles into this active range, they do so at the cost of restricting assembly area, decreasing yield, and drastically reducing throughput. We introduce a non-contact, multiphysics assembly technique that incorporates electrophoretic forces to achieve full-wafer nanoparticle integration. This presentation covers the finite element analysis of a novel electrode configuration and provides design and integration recommendations for incorporating nanoparticles into devices. Potential applications include active interposers, optical I/O, and added RF functionality.