Layered Electromagnetic Shielding: From Mechanisms to Fabrication

The rapid expansion of wireless electronics and advanced communication technologies has intensified the demand for next‐generation electromagnetic interference (EMI) shielding materials that are lightweight, ultrathin, flexible, and absorption‐dominant. Layered architectures derived from 2D materials—particularly graphene and MXenes—have emerged as strong candidates to address these requirements. Through transmission‐line and transfer‐matrix analyses with quantitative treatment of absorption loss and near‐field shielding, this review clarifies the fundamental mechanisms of EMI shielding and synthesizes recent advances in graphene‐, MXene‐ and related layered systems. Programmable control of stacking order, interlayer thickness, anisotropy, and interfacial chemistry is shown to steer performance from reflection‐dominated to absorption‐driven, achieving far‐field impedance matching while accommodating near‐field demands. Fabrication strategies are compared in terms of microstructural controllability and scalability, distilling concise, actionable design guidelines. Finally, key challenges and future opportunities are outlined, providing both theoretical foundations and practical direction for the rational design of multifunctional layered EMI shielding materials.