Novel system predicts cross-sectional images and improves processing in semiconductor packages, suggesting faster development.
We developed a novel system that quickly predicts cross-sectional images from experimental conditions to minimize cross-sectional processing. This has become a bottleneck in observing pattern shapes of materials used in substrate manufacturing. This system can predict cross-sectional images from experimental conditions and propose process conditions to form the desired pattern shape. We consider that using this system will improve the development speed of overall semiconductor packages.
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Motojima et al. (2025) studied this question.
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