Characterization of Novel Composite Materials with Radiation Shielding Properties for Electronic Encapsulation

It is well known that the space radiation environment, which has contributions from the trapped particles within the Van Allen belts, solar energetic particles (SEPs) and galactic cosmic rays (GCRs), directly influences space systems. These systems rely on complex and fragile electronic devices, whose performance can be degraded because of the action of the radiation and its related phenomena: single-event effects (SEEs), displacement damages (DDs) and total ionizing dose (TID). This could cause failures to arise through various mechanisms, ranging from parametric drift failures, such as leakage current and threshold voltage, among others, to destructive effects, like single-event burnout (SEB) or single-event latch-up (SEL). These failures in electronics affect the system’s reliability and its performance, which could compromise the mission’s success. Considering this, the main objective of the SRPROTEC project is to develop and validate new composite materials with better shielding performance against space radiation to increase the radiation tolerance of microelectronic devices encapsulated with these materials. For this purpose, three composites will be synthesized using a liquid epoxy resin filled with silica as a matrix mixed in different proportions, with a high-Z filler. The presence of low-Z elements from the high hydrogen content in the polymer and the presence of high-Z fillers are expected to produce a material with good radiation shielding properties. The developed materials will be exhaustively characterized, subjecting the three composites and control samples to rheological outgassing; gamma radiation shielding; and thermal, electrical, thermomechanical and moisture absorption, among other tests. Finally, the composite with the best performance will be selected and subjected to degradation tests (thermal cycling in vacuum, thermal cycling, thermal shock and relative humidity tests) to determine its suitability for space packaging applications.