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December 11, 2025SensorsOpen Access

A Multi-Parameter Inspection Platform for Transparent Packaging Containers: System Design for Stress, Dimensional, and Defect Detection

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Authors

HYH. Thomas YuZJZhongqing JiaCGChen Guan

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Overview

System design improves defect detection and dimensional accuracy in transparent packaging containers using deep learning.

Key Points

  • This research aims to develop a unified inspection platform for transparent packaging containers.
  • Developed an integrated system architecture for inspection tasks.
  • Implemented a shared-resource task scheduling mechanism.
  • Utilized telecentric imaging with subpixel contour extraction for dimensional measurement.
  • Adopted a YOLOv8-based deep learning model for surface defect detection.
  • Achieved a stress measurement error of ±3 nm.
  • Obtained dimensional accuracy of ±0.2 mm.
  • Reported a defect detection mAP@0.5 of 90.3%.

Cite This Study

Yu et al. (2025) studied this question.

synapsesocial.com/papers/69401b172d562116f28f7321https://doi.org/10.3390/s25247531
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