ABSTRACT To address the multifunctional protection requirements of missile‐borne electronic packaging under mechanical impact and electromagnetic interference, this paper for the first time proposes a ternary composite material of epoxy resin/hollow glass microspheres/MXene (Ep/HGM/MXene). By regulating the HGM volume fraction (20–40 vol.%) and MXene mass fraction (0.5–2 wt.%), the synergistic optimization of impact resistance, electromagnetic shielding, and electrical insulation properties is achieved. The results show that HGM significantly enhances the yield strength of the composite material (reaching 61 MPa when HGM is 40 vol.% and MXene is 2 wt.%), while MXene inhibits crack propagation through interfacial bridging and optimizes the specific energy absorption. In terms of electromagnetic performance, MXene dominates the absorptive electromagnetic shielding effectiveness in the THz band, and HGM improves impedance matching. All composite materials maintain high insulation (resistivity > 10 11 Ω·cm). This study provides a new strategy for the development of integrated missile‐borne electronic packaging materials with “impact resistance–electromagnetic shielding–insulation” capabilities.
Wang et al. (Mon,) studied this question.