Analysis shows dielectric and interfacial properties in MOS structures, indicating AlN's potential for low-leakage applications.
This study presents a comprehensive impedance spectroscopy (IS) analysis of Au/Ti/AlN/n-Si metal–oxide semiconductor (MOS) structures, with the aim of elucidating their dielectric and interfacial properties under different bias and frequency conditions. The real ( Z Z ′ ) and imaginary ( Z^ Z ′ ′ ) components of impedance were measured across 100 Hz–1 MHz and DC biases between 1 and 4 V, and the data were modeled using an equivalent circuit composed of a series resistance ( Rₛ R s ), a parallel resistance ( Rₚ R p ), and a parallel capacitance ( Cₚ C p ). The impedance spectra revealed a clear capacitive-to-resistive transition, while Cole–Cole plots consistently exhibited a single semicircle, confirming the presence of a unique relaxation mechanism. Relaxation times ( τ ), extracted both from Z^ Z ′ ′ –f peaks and Rₚ• Cₚ R p ∙ C p fitting, showed excellent agreement and demonstrated bias-dependent evolution, with accelerated relaxation at moderate bias and slower dynamics at higher bias due to trap saturation. Notably, Cₚ C p remained nearly constant across all biases, while Rₚ R p varied systematically, reflecting the influence of interfacial states. The analysis of normalized interface trap density further indicated progressive trap passivation with increasing bias, underscoring the stability of the AlN/Si interface. These findings validate the equivalent circuit model and highlight AlN as a promising dielectric material for high-frequency, low-leakage MOS applications, offering predictable relaxation behavior and reduced trap activity compared to conventional high-k dielectrics.
No takes yet. Share an insight, caveat, or question.
Büyükbaş-Uluşan et al. (2026) studied this question.
Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context: