Experimental realization of a new material shows enhanced thermal conductivity, indicating breakthroughs for electronics.
Efficient heat dissipation is fundamentally limited by intrinsic scattering mechanisms that cap the thermal conductivity of metallic materials such as copper to ~ 400 Watts per meter Kelvin. Here we report the experimental realization of single-crystalline θ-phase tantalum nitride (θ-TaN), a metastable transition metal nitride predicted to overcome this limitation. We measure a room-temperature thermal conductivity of ~1100 Watts per meter Kelvin, nearly three times that of copper. Synchrotron-based inelastic x-ray scattering reveals a distinctive phonon band structure with a large acoustic–optical gap and phonon bunching, which suppress phonon–phonon scattering. Ultrafast optical spectroscopy confirms exceptionally weak electron–phonon coupling and validates first-principles calculations. These findings redefine the thermal transport limits of metallic materials and open new opportunities for advancing thermal management in electronics and power systems.
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Li et al. (2026) studied this question.
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