We developed a complete packaging strategy for a 128-channel optical phased array (OPA) for Light Detection and Ranging (LiDAR) applications operating at a 1550 nm wavelength. The process comprised three major steps: waveguide end-facet polishing, fiber-to-optical waveguide pigtailing, and electrical wire bonding. Sequential polishing with silicon carbide paper followed by colloidal silica reduced coupling losses to 0.74 dB per facet. An automated fiber alignment setup was used to perform edge coupling. The electrical connections, formed under optimized wire-bonding conditions (18 mW ultrasonic power), achieved a bond strength of 4.66 gf while maintaining electrode-pad integrity. The final packaged device demonstrated uniform optical throughput, with a throughput power variation maintained below 0.2 dB following the packaging process, and a uniform electrical resistance of 0.48% across all 128 channels, verifying the process stability and packaging integrity. These results confirmed that the proposed packaging scheme offers a dependable route for photonic integration in LiDAR applications.
Sied et al. (Tue,) studied this question.