This investigation demonstrates improved thermal conductivity and mechanical properties in silicone rubber composites, highlighting the role of hybrid fillers in advanced thermal management.
Efficient heat dissipation is essential in modern high-performance electronics, where increasing power density and device miniaturisation create significant thermal management challenges. In this study, room-temperature vulcanised silicone rubber (RTV-SR) was reinforced with hybrid fillers—graphene oxide (GO) and hexagonal boron nitride (hBN)—to develop multifunctional composites with optimised thermal, mechanical, and electrical properties. The effects of filler type, concentration (5–20 wt%), and chemical surface modification using 3-aminopropyltriethoxysilane (APTES) were systematically investigated. Incorporating GO–hBN hybrids increased thermal conductivity by up to 185% (from 0.21 to 0.60 W·m − 1·K − 1) and improved thermal stability by 27 °C (T 50 shift), while enhancing tensile strength by 32% and Young’s modulus by 40% compared with pristine RTV-SR. The synergistic balance between the thermally conductive yet electrically insulating hBN and the mechanically reinforcing GO enabled simultaneous thermal enhancement and dielectric integrity, with dielectric strength increasing by 18% and electrical conductivity reduced by an order of magnitude compared to GO-only systems. Surface functionalisation with APTES ensured uniform filler dispersion, minimising agglomeration and further improving both mechanical and functional performance. These results position hybrid-filler RTV-SR composites as promising candidates for high-efficiency thermal interface materials, flexible dielectric layers, and mechanically robust components in electronics, automotive systems, and aerospace applications. Beyond these immediate uses, the findings provide a scalable design strategy for engineering next-generation silicone-based composites with tailored multifunctional performance.
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Ghaffarzadeh et al. (2026) studied this question.
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