Si-doped β-(AlxGa1−x)2O3 MESFETs grown via CIS-MOCVD on (010) β-Ga2O3

In this work, we demonstrate device fabrication and characterization of ultrawide bandgap (UWBG) β-(AlxGa1−x)2O3 channel metal–semiconductor field-effect transistors (MESFETs) with Si-implanted source/drain contacts. Films of Si-doped β-(AlxGa1−x)2O3 and unintentionally doped (UID) β-Ga2O3 were grown on an Fe-doped (010) β-Ga2O3 substrate using close-injection showerhead metal–organic chemical vapor deposition (CIS-MOCVD). The Al concentration (x) of the β-(AlxGa1−x)2O3 film was estimated to be ≈21% using x-ray diffraction (XRD), and the Si doping concentration of the n-type β-(Al0.21Ga0.79)2O3 film was measured to be 2 × 1018 cm−3 using secondary ion mass spectroscopy (SIMS). Both gate-recessed and non-recessed MESFET structures were fabricated and had on/off ratios of ≈105. The gate-recessed MESFETs had a lower saturation drain current (15 mA/mm) than the non-recessed structures (26 mA/mm), but they also had a slightly lower off-state leakage current. The gate-recessed structures also enabled better modulation of the channel conductivity, which led to a positive threshold voltage shift of +8V compared with the non-recessed structures. The maximum breakdown voltages of 730 and 858 V were measured for the gate-recessed and non-recessed MESFETs, respectively. Because the thermal conductivity of the disordered alloy β-(Al0.21Ga0.79)2O3 channel is expected to be much lower than β-Ga2O3, thermoreflectance imaging was used to assess the device-level thermal performance. At a DC power density of 0.58 W/mm (VGS = 0 V), an area-averaged gate temperature rise of 54 K was measured. This work demonstrates the potential of leveraging the large-area, low-cost, high-quality β-Ga2O3 substrate platform to develop next-generation power electronics using UWBG β-(AlxGa1−x)2O3 as the active semiconductor.