A Modular Ring-Oscillator Array Chip for Accurate Stress Testing of CMOS Aging Mechanisms

Javier Diaz-Fortuny; E. Bury; Robin Degraeve; Ben Kaczer

doi:10.1109/jssc.2026.3653472

January 1, 2026IEEE Journal of Solid-State CircuitsOpen Access

A Modular Ring-Oscillator Array Chip for Accurate Stress Testing of CMOS Aging Mechanisms

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Key Points

The research aims to develop a chip that can effectively test the aging mechanisms in CMOS technology using modular ring-oscillator arrays.
Design and fabrication of a modular ring-oscillator array chip
Implementation of stress testing protocols for CMOS components
Evaluation of aging mechanisms through real-time measurements
The modular design allows for precise control and accurate measurements of aging effects
Findings suggest improved understanding of stress impact on the longevity of CMOS devices
Demonstrated capability to identify specific aging mechanisms effectively

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Implication

This technical study demonstrates a chip-based approach for accurate stress testing of aging mechanisms in CMOS technology, indicating potential enhancements in durability.

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Diaz-Fortuny et al. (2026) studied this question.

synapsesocial.com/papers/698c1bb8267fb587c655d903 https://doi.org/10.1109/jssc.2026.3653472

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A Modular Ring-Oscillator Array Chip for Accurate Stress Testing of CMOS Aging Mechanisms

Key Points

No abstract yet

Implication

Abstract

Discussion

Cite This Study

A Modular Ring-Oscillator Array Chip for Accurate Stress Testing of CMOS Aging Mechanisms

Key Points

No abstract yet

Implication

Abstract

Discussion

Cite This Study

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