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February 14, 2026JOM

Microstructural Evolution, Mechanical Properties, and Thermal Reliability of Bi- and Ni-Doped Sn-Ag-Based Lead-Free Solder Alloys

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Authors

WLWei-Ting LinNational Central UniversityCHChia-Jung HsuNational Central UniversityPCPo-Kai ChangNational Central University

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Implication

Testing demonstrates improved fatigue life and reliability of lead-free solder alloys in drop tests, indicating better performance for electronic packages.

Key Points

  • This research aims to investigate the mechanical properties and thermal reliability of lead-free solder alloys.
  • Conducted high-temperature storage tests and Charpy impact tests.
  • Performed drop tests and thermal cycling to assess alloy reliability.
  • Compared Bi- and Ni-doped Sn-Ag-based alloys with conventional SAC305.
  • SABN and SACQ showed superior microstructural evolution compared to SAC305.
  • SAC-SABN joint displayed the best reliability in drop tests.
  • SABN joints exhibited enhanced fatigue life with specific Ag content.

Cite This Study

Lin et al. (2026) studied this question.

synapsesocial.com/papers/698fd276306598e8538deab6https://doi.org/10.1007/s11837-026-08175-y
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Also Consider

Synapse has enriched 3 closely related papers on similar clinical questions. Consider them for comparative context:

  1. 1Effect of Ag content on microstructure and mechanical properties of Sn−xAg−0.5Cu solder joints under rapid thermal shock2024 · 19 citations
  2. 2Influence of Cu content on microstructure, grain orientation and mechanical properties of Sn–xCu lead-free solders2022 · 21 citations
  3. 3Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review2022 · 75 citations