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April 1, 2022Transactions of Nonferrous Metals Society of ChinaOpen Access

Influence of Cu content on microstructure, grain orientation and mechanical properties of Sn–xCu lead-free solders

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KKKannachai KanlayasiriKing Mongkut's Institute of Technology LadkrabangNMNiwat MookamRajamangala University of Technology Rattanakosin

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Kanlayasiri et al. (2022) studied this question.

synapsesocial.com/papers/6a24b379df81b7caa3d3dfdfhttps://doi.org/10.1016/s1003-6326(22)65869-2
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