ABSTRACT In electrical power systems, thermal management is a critical challenge, particularly in electric vehicles (EVs), where compact packaging and high current densities lead to elevated temperatures that reduce electrical conductivity, intensify Joule heating, and promote thermal hotspot formation. Such hotspots can degrade semiconductor devices and weaken adhesive interfaces between conductors and dielectric layers. Conventional approaches often mitigate this issue by enlarging the heat transfer area, but this significantly increases design cost and material usage. To address this, the present work adopts a density‐based approach for topology optimization of EV DC bus bars under worst‐case operating conditions, ensuring that temperatures remain below the maximum allowable limit. The coupled thermo‐electrical response is simulated using the finite element method, and sensitivity analysis of the objective function and constraints is carried out via the adjoint variable method. The optimization employs the method of moving asymptotes (MMA) and is fully implemented in an object‐oriented C++ software.
Sinha et al. (Mon,) studied this question.