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February 24, 2026Open Access

Fast and Accurate Source Reconstruction for TSV-Based Chips via Contribution-Driven Dipole Pruning

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Authors

HCHao ChengWWWeimin WangYWYongle Wu

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Overview

Demonstrates enhanced source reconstruction in TSV-based chips, implying greater efficiency and accuracy for EMC diagnostics.

Key Points

  • The research aims to improve source reconstruction efficiency and accuracy for TSV-based chips by introducing a new preprocessing technique.
  • Developed a contribution-driven dipole preprocessing technique for source reconstruction.
  • Evaluated dipole components based on structural characteristics of TSV chips and PCB.
  • Validated the technique on multilayer PCB and TSV-based chip at different frequencies.
  • Achieved reconstruction accuracy with error increase limited to ≤0.2% for the simulated PCB and ≤0.05% for the physically measured TSV chip.
  • Reduced computational time by 28-61% for the PCB and 20-28% for the TSV chip compared to traditional methods.

Cite This Study

Cheng et al. (2026) studied this question.

synapsesocial.com/papers/699d3fe6de8e28729cf64ce9https://doi.org/10.3390/electronics15040890
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Also Consider

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  4. 4Hybrid Evolutionary Optimization of Coupling-Corrected Equivalent Sources for Anechoic Replication of Outdoor Electromagnetic Fields2026
  5. 5Imaging Spatially Varying Dielectric Samples Using Tightly Coupled Dipole Array Based Near-Field Sensing2026