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An in vitro study evaluates bond strength and failure patterns of universal adhesives in SE and TE modes, suggesting implications for clinical use.
Objectives: Universal adhesives (UAs) are marketed as versatile systems for both self-etch (SE) and total-etch (TE) modes. While their bond strength has been widely investigated, evidence linking fracture characteristics to bonding performance remains limited. This study evaluated the micro-shear bond strength (μSBS) and failure patterns of three UAs applied in SE and TE modes, complemented by fractographic scanning electron microscopy (SEM) analysis.Methods: Eighteen extracted human molars were sectioned to expose mid-coronal dentin and randomly allocated to SE or TE application. Three UAs were tested: Tetric N-Bond Universal, All-Bond Universal, and Single Bond Universal (SBU). Composite micro-rods (n = 72) were bonded, thermocycled for 500 cycles between 5°C and 55°C, and subjected to μSBS testing. Fracture surfaces were examined under SEM and classified as adhesive, cohesive, or mixed. Data were analyzed using two-way analysis of variance, Tukey post hoc test, and Spearman correlation (α = 0.05).Results: In TE mode, SBU demonstrated the highest μSBS (p < 0.001), whereas no significant differences were observed among adhesives in SE mode (p > 0.05). SEM analysis revealed adhesive failures as interfacial fractures, cohesive failures with beach marks, and mixed failures involving crack propagation through both dentin and composite. Adhesive failures correlated negatively with μSBS (rs = –0.77), while mixed failures correlated positively (rs = 0.81).Conclusions: Both the etching strategy and adhesive formulation significantly affect bond strength and fracture behavior. Fractographic SEM analysis provides critical insights into the mechanical reliability of UAs and informs their clinical application.
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Morsy et al. (2026) studied this question.
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