The surge in generative AI applications is reshaping the landscape of semiconductor hardware, necessitating advanced power delivery solutions to meet escalating demands for efficiency and performance. High-performance microprocessors and accelerators, integral to data centers, require power delivery networks capable of managing higher currents and power densities while operating at lower voltages. This paper addresses the critical challenges posed by embedded passive components, specifically capacitors and inductors, while proposing a potential embedded voltage regulation (eVR) STile™. As AI workloads intensify, traditional power delivery methods struggle to provide the necessary energy without compromising spatial constraints on circuit boards. We introduce an innovative approach that leverages embedded passive technology to enhance power efficiency. Our findings demonstrate that integrating capacitors and optimized inductors directly into the package substrate not only increases effective capacitor density but also facilitates vertical power delivery (VPD). This advancement minimizes the distance between the power source and the load, ensuring optimal performance in a compact form factor. By addressing these power delivery challenges, we pave the way for the next generation of semiconductor hardware tailored to the demands of next generation AI applications. Ensuring optimal power signal integrity is vital for maintaining stable voltage delivery across a wide frequency range. A standard design methodology focuses on minimizing the impedance seen by the load’s input nodes, thereby reducing voltage ripple and droop during transient events. Although connecting multiple surface-mount device (SMD) capacitors in parallel can help achieve low impedance, careful consideration of anti-resonance effects due to inductance is essential, as these can generate unwanted peaks in impedance and lead to voltage instability. The inherent inductance associated with traditional SMD configurations can diminish efficiency and complicate power delivery. In contrast, STile technology improves performance by embedding capacitors closer to the load, significantly reducing parasitics and optimizing space for both VPD and embedded voltage regulation (eVR) solutions. This approach not only alleviates traditional design challenges but also maximizes the available PCB area for critical power modules. To minimize I²R losses, efficient power delivery demands higher voltages and low current levels at the package substrate level. While conventional power regulator topologies typically utilize inductors to achieve high conversion efficiencies, integrating inductors onto the die can complicate design and elevate costs. The STile technology provides a groundbreaking solution by enabling the co-location of inductors and capacitors within a customizable three-terminal LC passive module (patent pending) embedded in the core substrate. This integration allows for precise alignment with processor power domains, significantly reducing the need for lateral metal routing. Additionally, the flexible layout of the LC passive modules supports multiple power domains, facilitating interleaved multiphase outputs and innovative configurations such as sharing output capacitors among several inductors. By addressing these design challenges, eVR STile technology significantly enhances power delivery efficiency while meeting the stringent demands of next-generation semiconductor applications. This paper emphasizes the development of advanced, highly integrated capacitor solutions that deliver superior performance for next-generation power delivery systems. By leveraging STile technology, we illustrate how embedding capacitors and inductors within the substrate not only enhances power signal integrity and minimizes parasitics but also optimizes space for embedded voltage regulation (eVR). This innovative platform enables the creation of custom eVR designs tailored to specific application requirements, significantly improving efficiency in high-performance computing environments. Through our findings, we highlight the transformative potential of these embedded passive components in addressing the power delivery challenges faced by next generation artificial intelligence chips.
Bart DeProspo (Wed,) studied this question.