Robust heat-free curing via ‘SiNergy’ in action: Residual cure kinetics and thermal stability of epoxy Silicon Nitride / Tungsten Carbide dual filler nanocomposites

Key Points

• Enhanced thermal stability was observed in epoxy nanocomposites containing silicon nitride and tungsten carbide.
• Key metrics include robust cure kinetics and stability when using the SiNergy approach.
• Observational analysis assessed the dual filler composition effects on epoxy performance and behavior.
• These findings support the applicability of SiNergy in improving material performance under varying conditions.