Microstructure and thermal conductivity of diamond/copper composite prepared by spark plasma sintering

Key Points

• Enhanced thermal conductivity observed in the diamond/copper composite, promoting effective heat transfer in various applications.
• A significant improvement of up to 40% in thermal conductivity compared to traditional copper materials was achieved.
• Spark plasma sintering was utilized to prepare the composite, utilizing high temperatures and pressures for enhanced material integration.
• Potential applications of this composite include better heat dissipation in electronic components and improved thermal management systems.