Dynamic Bonding Prediction and Deformation Characteristics Analysis of Cu/Al Composite Plates Rolling Interface

One of the focal points in the numerical analysis of the bimetallic plates rolling composite process is the investigation of interfacial behavior. However, current simulation technologies require further optimization for dynamic prediction of composite plates interfacial behavior and applicability to various processes. A model integrating the normal penalty contact algorithm and the tangential elastic stick algorithm has been developed for the rolling process of bimetallic composite plates, achieving dynamic prediction from contact to bonding of the bimetallic. By analyzing the bonding positions under different criterion conditions, it was found that as the surface expansion threshold increases, the initial bonding position of the composite plate gradually delays in the deformation zone, and the macroscopic warpage of the composite plate decreases accordingly. Rolling experiments with different reduction rates were conducted using Cu/Al composite plates to verify the model's accuracy. The results show that compared to the experiment, the maximum relative errors of the traditional interface bonding constraint (bond in advance) and sliding constraint (friction only) models are 7.6% and 10.6%, respectively. In comparison, the dynamic composite model is only 3.2%. The dynamic composite model can fully utilize the bonding criterion to accurately describe the distribution of interface bonding position, speed, equivalent plastic strain, and stress, and can accurately predict warpage, laying the foundation for the optimization of rolling process and the development of metallurgical bonding constitutive models.