Towards universal multi-dimensional parallelization communications by direct diverse fiber/3D/2D chip hybrid integration

Space-division multiplexing (SDM) is a promising technology for significantly increasing the capacity of a single fiber or waveguide. Various SDM fibers, including few-mode fibers (FMFs), multi-core fibers (MCFs), and orbital angular momentum fibers (OAMFs), demonstrate distinct advantages in fiber links, driving a prevailing trend toward their parallel utilization. Photonic integrated circuits extend SDM from long-distance fibers to chip-scale interconnects. However, mode-field mismatches between fibers and chips pose compatibility challenges. Here, we develop diverse fiber-chip couplers via fiber/3D/2D chip hybrid integration to achieve seamless "fiber-to-fiber" and "fiber-to-chip" mode-field conversions. Building on this, we integrate large-scale, multifunctional 2D silicon chips to construct a fiber-chip-fiber system compatible with FMF, MCF, OAMF, and single-mode fibers. This parallel communication successfully demonstrates 288 channels (8 spatial modes and 36 wavelengths) and 30-Tbit/s capacity. This work establishes a universal multi-dimensional parallelization communication architecture, paving the way for next-generation multi-dimensional data transmission and management.