Guest Editorial of Special Issue on “Silicon-Package-Rack-Data Center Thermal Management Challenges, Opportunities, and Solutions”

Opportunities, and Solutions"With the rapid growth of artificial intelligence (AI) and high-performance computing (HPC) workloads, the power density of modern computing systems continues to increase dramatically.Coupled with the growing complexity of advanced packaging architectures such as 2.5D and 3D integration, future data centers face unprecedented thermal management challenges.These challenges include increased energy consumption, limitations of conventional cooling technologies, and suboptimal system-level energy utilization.This Special Issue aims to address key challenges, opportunities, and solutions across multiple length scales, spanning from silicon and package levels to rack and full data-center infrastructures.Thermal management challenges associated with emerging optical packaging technologies-particularly co-packaged optics (CPO)-are also focus of this Special Issue.