Scalable and Integrated Microsupercapacitors

In this study, we developed a water‐based ink composed of the polymer poly(3,4‐ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS) and carbon nanotube (CNT) to fabricate flexible planar microsupercapacitor (MSC) using scalable manufacturing techniques. The research focused on optimizing aspects of electrochemical performance, including electrode design, ionic concentration, film thickness, electron‐collecting layers, encapsulation, circuit interconnection, and integration into practical applications such as powering a self‐sufficient circuit equipped with a Near Field Communication temperature sensor. MSCs fabricated with 12 layers achieved a high areal capacitance of 212.4 mF·cm −2 and a low internal resistance of 12 Ω, as well as demonstrated favorable energy and power densities of 16.6 μW·h·cm −2 and 318.7 μW·cm −2 , respectively. Furthermore, the capacitance retention remained above 85% after 5000 charge–discharge cycles, indicating good cycling stability. Notably, the system works efficiently without the need for an electron‐collecting layer, thanks to the high conductivity of the developed ink, which facilitated both charge storage and transport. Interconnected MSC circuits were successfully integrated into a self‐sustaining system powered by a solar device, which operated an NFC temperature sensor for over 17 min. Overall, the materials and scalable fabrication methods presented in this study offer a versatile, efficient, and environmentally friendly route for producing high‐performance MSCs.