Spatial Distribution of Cu Atoms Sputtered from Copper Target in RF Magnetron Sputtering

The spatial distribution of Cu atoms sputtered from a copper target in an RF magnetron sputtering was measured by the use of a quartz-crystal deposition monitor. At Argon pressure of 20 Pa, the angular distribution of sputtered atoms had a cosine-like distribution. At the lower Argon pressure, however, the deposition rate decreased at the front the target. This decrease was due to energetic neutral Ar atoms which bombarded and evaporated the growing films at the front of the target. The spatial distribution of Cu atoms sputtered from the target was simulated using the Monte Carlo method and compared with the observed result.