Resolving the thermal challenges for silicon microring resonator devices

Silicon microring resonators have been hailed for their potential use in next‐generation optical interconnects. However, the functionality of silicon microring based devices suffer from susceptibility to thermal fluctuations that is often overlooked in their demonstrated results, but must be resolved for their future implementation in microelectronic applications. We survey the emerging efforts that have been put forth to resolve these thermal susceptibilities and provide a comprehensive discussion of their advantages and disadvantages.