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Demonstrates improved doping control in silicon solar cells using inkjet printing technology, suggesting a simpler manufacturing process.
The fabrication of localized doped polycrystalline silicon (poly‐Si) passivating contacts, such as in an interdigitated back contact (IBC) solar cell, is complex and costly. Inkjet printing offers a promising route to simplify this process; however, unintended doping and cross‐doping from the liquid dopant sources remain a significant challenge. This study demonstrates the effectiveness of a spin‐on SiO x capping layer in suppressing unintended doping in unprinted regions and cross‐doping between dopant species, enabling the simultaneous formation of localized n+ and p+ poly‐Si passivating contacts using inkjet printing via a single high‐temperature annealing step. Secondary ion mass spectrometry (SIMS) mapping reveals uniform doping concentrations within the printed lines, approximately 1 × 10 20 cm −3 for phosphorus and 2 × 10 20 cm −3 for boron in the poly‐Si layers with minimal lateral diffusion at the line edges. More importantly, unintended doping is now reduced to below 9 × 10 17 cm −3 , just 0.5% of the source doping concentrations. Additionally, cross‐doping in the printed region of opposite polarity remains below 5 × 10 18 cm −3 , which is less than 2.6% of the intended doping. These results pave the way for the potential adoption of inkjet printing in simplifying the fabrication of solar cells and other electronic devices.
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Wang et al. (2026) studied this question.
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