Review explores alumina film formation via advanced deposition techniques, indicating its potential for insulation applications.
Aerosol (Gas) Deposition (AD or AGD) has evolved as a film deposition technique capable of forming dense films at room temperature without heating and melting ceramic powders. This paper reviews the current understanding of the film formation mechanism in AGD (including AD), focusing particularly on alumina film formation. It outlines the effects of raw powder characteristics, deposition conditions, and advancements in deposition equipment on film structure and electrical properties.
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Fuchita et al. (2026) studied this question.
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