Advances in Phase Change Materials for Thermal Energy Storage and Management: Challenges and Enhancement Strategies

The accelerating demand for high-performance thermal management in electronics and renewable energy systems has positioned phase change materials (PCMs) as critical components for passive temperature regulation due to their substantial latent heat, which absorbs the significant heat generated by electronic devices. This review offers a comprehensive analysis of PCMs, covering their selection criteria, classification, encapsulation techniques, and strategies for performance enhancement in thermal energy storage (TES) and thermal management systems in electronic devices. Despite significant advancements in PCM-based technologies, the incorporation of nanomaterials into PCMs to enhance thermal conductivity involves a series of interconnected trade-offs that lead to latent heat capacity reduction, leakage, viscosity, cyclic performance and durability, and physical and chemical stability that hinder their widespread adoption. In addition, this review presents a paradigm shift toward supramolecular phase change materials (SPCMs)─an advanced class of materials that transcend the limitations of their traditional counterparts through the strategic exploitation of dynamic, noncovalent interactions, including hydrogen bonding and π–π stacking. These supramolecular architectures uniquely combine shape stabilization with emergent functionalities, such as self-healing capability, reprocessability, and exceptional dimensional stability, during phase transitions. We provide a systematic analysis of advanced modification and optimization strategies driving SPCM composite innovation. Key focuses include sophisticated encapsulation techniques, such as supramolecular lock shell layers, nanomaterials, nanoparticles, and porous matrix confinement, which achieve ultrahigh core loadings with exceptional cycling stability. Particular emphasis is placed on the strategic integration of functional nanofillers via surface chemical functionalization and noncovalent π–π stacking. These approaches uniquely overcome classical material trade-offs, simultaneously enhancing thermal conductivity and mechanical robustness while preserving latent heat capacity─achievements unattainable with conventional PCMs. This review provides a focused roadmap for developing scalable, durable SPCMs tailored for next-generation thermal management applications.