Sintered Cu nanoparticles (Cu NPs) are promising interconnection materials for high-temperature power electronics, yet how their authentic three-dimensional pore architecture governs microscale deformation remains unclear. Here, synchrotron nano-computed tomography (nano-CT) was combined with in-situ micropillar compression, explicit dynamic elastoplastic finite element analysis, and TEM/TKD characterization to interrogate sintered Cu NPs. The nano-CT voxel size was 45 nm, and the reconstructed volume corresponded to a cylinder 16 µm in diameter and 10 µm in height. The average sectional porosity was 12.44%, with a systematic discrepancy between two-dimensional and three-dimensional porosity quantification. During loading, the porosity decreased to 9.55% while the pore aspect ratio increased from 1.82–2.35. Finite element analysis further showed pronounced pore-adjacent stress/strain localization at the elastic–plastic transition, with local stress and equivalent plastic strain reaching 650 MPa and 1.7 × 10−2, compared with 250 MPa and 1.1 × 10−3 in adjacent regions. The GND density increased by 95.9% at a compressive strain of 26%, linking pore-induced strain gradients to dislocation accumulation. These results quantitatively connect authentic three-dimensional pore architecture, local deformation localization, and dislocation-mediated strengthening in sintered Cu NPs.HighlightsSynchrotron nano-CT (45 nm voxel size) reconstructed a 16 × 10 µm cylindrical volume of sintered Cu NPs and resolved the authentic 3D pore network.Sectional porosity was 12.44%, and 2D/3D quantification showed a systematic discrepancy, with porosity decreasing to 9.55% and pore aspect ratio increasing from 1.82 to 2.35 during compression.Pore-adjacent localization was quantified at the elastic–plastic transition, with local stress/PEEQ reaching 650 MPa and 1.7 × 10−2 versus 250 MPa and 1.1 × 10−3 in adjacent regions.A 95.9% increase in GND density at 26% compressive strain links pore-induced strain gradients to dislocation accumulation and strain-gradient-driven strengthening.
Fan et al. (Sat,) studied this question.