Finite element study demonstrates improved voltage output in high-frequency sensors for acoustic emission monitoring, indicating effective electromechanical coupling.
Acoustic emission (AE) monitoring in metal additive manufacturing (AM) requires compact sensors capable of high-frequency operation, broad bandwidth, and high sensitivity. However, increasing structural stiffness to achieve high resonance frequencies typically reduces electromechanical sensitivity. This work presents a finite element study of a coupled-resonator capacitive micromachined ultrasonic transducer (CMUT) designed to address this trade-off. The proposed architecture integrates three mechanically coupled silicon membranes with a stepped capacitive cavity that increases capacitance while preserving structural stiffness, enabling enhanced sensitivity without compromising high-frequency operation. COMSOL Multiphysics simulations were used to evaluate modal characteristics and frequency response under DC pre-stressed conditions. Modal coupling produced closely spaced resonances that broadened the effective bandwidth, while the stepped cavity significantly increased voltage output through improved electromechanical coupling. Compared to a single-resonator flat-cavity design, the coupled stepped-cavity configuration demonstrated nearly a threefold enhancement in output voltage while maintaining operation near 100 kHz. Additionally, adjusting the central resonator length enabled controlled frequency tuning for scalable array implementation. These results establish a proof of concept for a high-frequency, high-sensitivity micro-electro-mechanical systems (MEMS) CMUT architecture suitable for distributed AE monitoring in advanced manufacturing environments.
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Mohaidat et al. (2026) studied this question.
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