In the recent information society, particularly featured in the advent of fifth-generation (5G) telecommunication systems and beyond, low dielectric loss polymers (LDPs) have received increasing attention because of their excellent insulation properties, suitable for printed circuit board (PCB) applications in electronic devices to realize high-speed and high-capacity data processing. However, the rapid high-frequency shift in communication requires not only even lower dielectric loss (dielectric constant Dk < 2.5 and dissipation factor Df < 0.001 in the GHz range) but also other required properties (e.g., thermostability, dimensional stability, thermal conductivity, adhesiveness, and flame retardancy) of LDPs, all of which are essential in PCBs for next-generation communications. In this review, we summarize the recent progress in molecular design, synthesis, properties, and applications of LDPs for next-generation electronics, in addition to their outlook to realize further accelerated and low-loss telecommunication systems.
Watanabe et al. (Mon,) studied this question.