Dvelopment of novel low dielectric epoxy resin

In recent years, low transmission loss in electronic devices has been strongly demanded due to the increasing speed and capacity of communication and computation. Therefore, the most important property is low dielectric constant. Fluorine resins and LCPs have been studied for high-frequency applications because of their low dielectric properties, but their workability and adhesiveness are poor. Epoxy resins have excellent processability and adhesiveness, and are used for electronic substrate applications. However, there are few reports of systematic studies focusing on molecular structure to further lower the dielectric constant. Therefore, we evaluated 21 epoxy resins to investigate their potential for low dielectric properties. As a result, there were three epoxy resins with excellent low dielectric properties among the evaluated epoxy resins. They were molecular skeletons that suppressed rotational motion. This study showed that appropriate molecular design suppresses rotation of the molecular skeleton, resulting in further lowered dielectric properties.