A resin with low dielectric loss properties was synthesized for high-frequency semiconductor packaging material applications. The developed resin compositions demonstrate and high thermal stability (Td5%, loss: 412~ 416°C). By addition 83wt% of silica filler, the Dk and Df at 50GHz of LLC-2 are 3.12 and 0.0027 respectively. High temperature and high humidity stability (85°C/85%RH) of LLC was also evaluated, after 10 days testing, there was no significant change in Dk; the variation rate of Df at 28GHz was only 2.3 %. The low dielectric material developed in this study shows a promising properties for high frequency packaging application.
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Hsu et al. (2024) studied this question.
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