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March 1, 2003IEEE Transactions on Components and Packaging Technologies

Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging

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Authors

HAHaleh ArdebiliUniversity of HoustonEWE.H. WongInstitute of MicroelectronicsMPMichael PechtUniversity of Mary

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Ardebili et al. (2003) studied this question.

synapsesocial.com/papers/69f4832b3c609279b4e25a1ehttps://doi.org/10.1109/tcapt.2002.806172
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