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May 7, 2026Applied Physics Letters

Computational analysis of parameter optimization and manufacture mechanics of LIG flexible electrode

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Authors

XZXi ZhangWZW Z ZhangJLJohan Liu

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Overview

Computational analysis reveals the correlation of temperature with energy density in flexible electronics, suggesting optimal conditions for LIG.

Key Points

  • The study aims to investigate the mechanics of manufacturing LIG flexible electrodes through computational analysis.
  • Constructed a heat transfer model using the finite element method to simulate temperature distribution on PI films during laser scanning.
  • Analyzed the thermal decomposition of PI films in the temperature range of 2800–3400 K using molecular dynamics simulations.
  • Demonstrated a linear positive correlation between temperature and laser energy density.
  • Showed that LIG has a larger specific surface area at higher temperatures, optimizing hexagonal carbon ring structures.

Cite This Study

Zhang et al. (2026) studied this question.

synapsesocial.com/papers/69fbf004164b5133a91a4366https://doi.org/10.1063/5.0320595
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