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October 30, 2006IEEE Transactions on Microwave Theory and Techniques

Design and Development of a Package Using LCP for RF/Microwave MEMS Switches

M.J. Chen Anh‐Vu Pham N. Evers Chris Kapusta Joseph Iannotti William Kornrumpf John Maciel Nafiz Karabudak

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Abstract

We present the development of an ultrahigh moisture-resistant enclosure for RF microelectromechanical system (MEMS) switches using liquid-crystal polymer (LCP). A cavity formed in LCP has been laminated, at low temperature, onto a silicon MEMS switch to create a package. The LCP-cap package has an insertion loss of less than 0.2 dB at X-band. E595 outgas tests demonstrate that the LCP material is suitable for constructing reliable packages without interfering with the operation of the MEMS switch. The package also passes Method 1014, MIL-STD-883 gross leak, and fine leak hermeticity tests

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Chen et al. (2006) studied this question.

synapsesocial.com/papers/69fcd12f9cdf468d93e3df3e https://doi.org/10.1109/tmtt.2006.884639

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