Enhanced Lithographic Imaging Layer Meets Semiconductor Manufacturing Specification a Decade Early

This scanning electron microscopy image (∼2 μm wide) depicts high-aspect-ratio features patterned in silicon using sequential infiltration synthesis (SIS) enhancement of photoresist. SIS penetrates the polymeric resist layer with etch-resistant alumina, thereby transforming it into a hard mask. This conversion enables the use of very thin resist layers, so pattern collapse is virtually eliminated and goals set forth for lithography in 2022 can be achieved today. Detailed facts of importance to specialist readers are published as ”Supporting Information”. Such documents are peer-reviewed, but not copy-edited or typeset. They are made available as submitted by the authors. Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.